1 / 4 w ww.asb.co.kr j u n e 20 1 7 p lerow tm ALN0926AT internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation term inals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementa tion to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production leve l. parameter unit specifications min typ max frequency range mhz 890 960 gain db 17.5 18.5 gain flatness db ? 0.5 ? 0.6 noise figure db 0.60 0.65 output ip3 (1) dbm 28 29 s11 / s22 (2) db - 18 / - 10 output p1db dbm 1 4 15 switching time ? sec - supply current ma 40 50 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 19 db @ 890 mhz = 18 db @ 960 mhz nf of 0.6 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) ALN0926AT asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 1 - stage single type typ. @ t = 25 ? c, v s = 5 v, freq. = 925 mhz, z o.sys = 50 ohm solder stencil area specifications (in pr o duction)
2 / 4 w ww.asb.co.kr j u n e 20 1 7 p lerow tm ALN0926AT internally matched lna module s - param e ters noise figure oip3 p1db 890~960 mhz +5 v typical performance (measured) s - param eters & k fa c tor
3 / 4 w ww.asb.co.kr j u n e 20 1 7 p lerow tm ALN0926AT internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) curre nt (ma) 4.5 - 17.38 - 11.83 18.71 0.67 0.598 14.40 28.17 31 4.6 - 17.70 - 11.92 18.76 0.67 0.595 14.65 28.55 32 4.7 - 17.98 - 12.04 18.79 0.67 0.594 15.10 29.00 34 4.8 - 18.26 - 12.12 18.82 0.67 0.586 15.31 29.42 35 4.9 - 18.52 - 12.21 18.84 0.67 0.588 15.51 29 .64 37 5.0 - 18.79 - 12.29 18.87 0.67 0.587 15.69 30.07 38 5.1 - 19.04 - 12.36 18.90 0.67 0.598 15.87 30.43 39 5.2 - 19.28 - 12.44 18.93 0.67 0.597 16.04 30.76 41 5.3 - 19.49 - 12.50 18.94 0.67 0.595 16.22 31.04 42 5.4 - 19.73 - 12.57 18.96 0.67 0.592 16.39 31. 42 44 5.5 - 19.93 - 12.64 18.98 0.67 0.601 16.56 31.74 45 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 19.31 - 12.06 19.43 0.74 0.416 15.30 30.40 35 - 20 ? c - 19.56 - 12.26 19.19 0.75 0.476 15.28 29. 97 36 0 ? c - 19.34 - 12.17 19.17 0.75 0.519 15.23 29.65 37 25 ? c - 19.23 - 12.21 19.01 0.76 0.592 15.10 29.33 38 40 ? c - 18.60 - 12.19 18.99 0.76 0.639 15.19 29.34 39 60 ? c - 18.24 - 12.19 18.90 0.76 0.694 15.14 29.13 39 80 ? c - 17.66 - 12.27 18.81 0.76 0.761 15.08 29.04 40 100 ? c - 17.30 - 12.33 18.72 0.76 0.828 14.88 28.69 40 rf performance with voltage change rf performance with operating temperature
4 / 4 w ww.asb.co.kr j u n e 20 1 7 p lerow tm ALN0926AT internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc su pply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. the refore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. copyright ? 2007 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assu mes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. preliminary application circuit recomm ended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm) preliminary
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